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Publisher: Emerald Group Publishing Limited

Volume 19, Number 3, 2007

Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag
pp. 3-8(6)
Authors: Kim, Mi Jin; Zhou, Y. (Norman); Jung, Jae Pil

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The evolution of paste pressure during stencil printing
pp. 9-14(6)
Authors: Clements, David J.; Desmulliez, Marc P.Y.; Abraham, Eitan

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Interfacial reactions between Sn-based solders and AgPt thick film metallizations on LTCC
pp. 15-25(11)
Authors: Nousiainen, Olli; Kangasvieri, Tero; Rönkä, Kari; Rautioaho, Risto; Vähäkangas, Jouko

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Multiphysics simulation of microwave curing in micro-electronics packaging applications
pp. 26-33(8)
Authors: Tilford, T.; Sinclair, K.I.; Bailey, C.; Desmulliez, M.P.Y.; Goussettis, G.; Parrott, A.K.; Sangster, A.J.

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