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Publisher: Emerald Group Publishing Limited

Volume 19, Number 2, 2007

Dissolution of copper on Sn-Ag-Cu system lead free solder
pp. 4-11(8)
Authors: Izuta, Goro; Tanabe, Tsuyoshi; Suganuma, Katsuaki

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Global environmental impact assessment of the Pb-free shift
pp. 18-28(11)
Authors: Andrae, Anders S.G.; Itsubo, Norihiro; Inaba, Atsushi

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High-cycle fatigue testing of Pb-free solder joints
pp. 29-38(10)
Authors: Barry, N.; Jones, I.P.; Hirst, T.; Fox, I.M.; Robins, J.

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