Provider: Ingenta Connect Database: Ingenta Connect Content: application/x-research-info-systems TY - ABST AU - Liang, J. AU - Dariavach, N. AU - Callahan, P. AU - Shangguan, D. TI - Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls JO - Soldering & Surface Mount Technology PY - 2007-02-13T00:00:00/// VL - 19 IS - 1 SP - 4 EP - 14 UR - https://www.ingentaconnect.com/content/mcb/219/2007/00000019/00000001/art00001 ER - TY - ABST AU - Liu, Yueli AU - Johnson, R. Wayne TI - Optimization of lead free solder 01005 component assembly JO - Soldering & Surface Mount Technology PY - 2007-02-13T00:00:00/// VL - 19 IS - 1 SP - 15 EP - 27 UR - https://www.ingentaconnect.com/content/mcb/219/2007/00000019/00000001/art00002 ER - TY - ABST AU - Gao, JinGang AU - Wu, YiPing AU - Ding, Han TI - Optimization of a reflow soldering process based on the heating factor JO - Soldering & Surface Mount Technology PY - 2007-02-13T00:00:00/// VL - 19 IS - 1 SP - 28 EP - 33 UR - https://www.ingentaconnect.com/content/mcb/219/2007/00000019/00000001/art00003 ER - TY - ABST AU - Wang, Yu AU - Olorunyomi, Michael AU - Dahlberg, Martin AU - Djurovic, Zoran AU - Anderson, Johan AU - Liu, Johan TI - Process and pad design optimization for 01005 passive component surface mount assembly JO - Soldering & Surface Mount Technology PY - 2007-02-13T00:00:00/// VL - 19 IS - 1 SP - 34 EP - 44 UR - https://www.ingentaconnect.com/content/mcb/219/2007/00000019/00000001/art00004 ER -