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Publisher: Emerald Group Publishing Limited

Volume 19, Number 1, 2007

Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls
pp. 4-14(11)
Authors: Liang, J.; Dariavach, N.; Callahan, P.; Shangguan, D.

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Optimization of lead free solder 01005 component assembly
pp. 15-27(13)
Authors: Liu, Yueli; Johnson, R. Wayne

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Optimization of a reflow soldering process based on the heating factor
pp. 28-33(6)
Authors: Gao, JinGang; Wu, YiPing; Ding, Han

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Process and pad design optimization for 01005 passive component surface mount assembly
pp. 34-44(11)
Authors: Wang, Yu; Olorunyomi, Michael; Dahlberg, Martin; Djurovic, Zoran; Anderson, Johan; Liu, Johan

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