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Publisher: Emerald Group Publishing Limited

Volume 18, Number 4, 2006

Laser soldering control using optical imaging
pp. 3-11(9)
Authors: Gilbert, James M.; Dabestani, Zaif

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Reliability of ACA bonded flip chip joints on LCP and PI substrates
pp. 12-20(9)
Authors: Frisk, Laura; Cumini, Anne

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Failure analysis techniques for lead-free solder joints
pp. 21-27(7)
Authors: Castello, Todd; Rooney, Dan; Shangguan, Dongkai

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Determining conformal coating protection
pp. 38-47(10)
Authors: Hunt, Christopher; Mensah, Angela; Buxton, Anthony; Holman, Richard

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The effect of reflow profile on SnPb and SnAgCu solder joint shear strength
pp. 48-56(9)
Authors: Pan, Jianbiao; Toleno, Brian J.; Chou, Tzu-Chien; Dee, Wesley J.

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