Dissolution of stainless steels in molten lead-free solders

Purpose ‐ To determine the endurance of stainless steels used for wave soldering container materials in molten lead-free solders. Design/methodology/approach ‐ A dissolution test on stainless steel wires in molten lead-free solders was performed. The effects of the composition of the stainless steel, test period, and composition of the lead-free solder on the dissolution rate were investigated. Dissolution was measured by cross-sectioning the wires and measuring the reduction in radius. Findings ‐ The Sn-Ag lead-free solder showed faster dissolution than did the conventional Sn-Pb eutectic. A severe dissolution rate was also observed for the Sn-Zn system. Practical implications ‐ Quantitative data for the reaction rate between stainless steels and molten lead-free solder is useful for the design of soldering machines and in planning their maintainance. Originality/value ‐ This paper shows the effect of basic factors on the dissolution rate of stainless steels in molten solder. It can give a basic understanding to engineers of the effect of lead free solders on wave soldering process equipment.