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Publisher: Emerald Group Publishing Limited

Volume 18, Number 3, 2006

A novel crack and delamination protection mechanism for a WLCSP using soft joint technology
pp. 3-13(11)
Authors: Yew, Ming-Chih; Chiu, Chien-Chia; Chang, Shu-Ming; Chiang, Kuo-Ning

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Learning from the migration to lead-free solder
pp. 14-18(5)
Authors: Ciocci, Richard; Pecht, Michael

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Minimizing flux spatter during lead-free reflow assembly
pp. 19-23(5)
Authors: Manjunath, Deepak; Iyer, Satyanarayan; Eckel, Shawn; Damodaran, Purushothaman; Srihari, Krishnaswami

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Dissolution of stainless steels in molten lead-free solders
pp. 24-30(7)
Authors: Takemoto, Tadashi; Takemoto, Masaharu

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