ISSN 0954-0911 (Print)
Publisher: Emerald Group Publishing Limited
RLC effects in fine pitch anisotropic conductive film connections
Dou, G.; Chan, Y.C.; Morris, J.E.; Whalley, D.C.
Implementing lead-free solders ? the performance aspects
Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5Ag solder joints
Rhee, H.; Subramanian, K.N.
Design of a flexible assembly and remanufacturing cell for advanced SM components: selection of cell design concept based on reflow tools
Geren, N.; Ãakirca, M.; Bayramoglu, M.
Modelling of microstructure and damage evolution in Sn-Pb solder
Wei, Y.; Chow, C.L.; Fang, H.E.; Lu, W.Y.; Lim, J.