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Publisher: Emerald Group Publishing Limited

Volume 17, Number 4, 2005

Effect of PCB surface finish on creep properties of lead-free solder joints
pp. 3-9(7)
Authors: Sundelin, Janne J; Nurmi, Sami T; Lepistö, Toivo K; Ristolainen, Eero O

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Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling
pp. 10-16(7)
Authors: Chang, Junling; Janz, Dirk; Kempe, W; Xie, Xiaoming

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Correlation between jamming and skipping during solder paste printing
pp. 17-26(10)
Authors: Hillman, S.R.; Mannan, S.H.; Durairaj, R; Seman, A; Ekere, N.N.; Dusek, M; Hunt, C

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Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder joints
pp. 38-45(8)
Authors: Sun, Peng; Andersson, Cristina; Wei, Xicheng; Cao, Liqiang; Cheng, Zhaonian; Liu, Johan

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