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Publisher: Emerald Group Publishing Limited

Volume 17, Number 3, 2005

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
pp. 3-8(6)
Authors: Huang, Meng-Kuang; Lee, Chiapyng; Wu, Pei-Lin; Tzan, Shyh-Rong

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Effect of SnAgCu composition on soldering performance
pp. 9-19(11)
Authors: Huang, Benlih; Dasgupta, Arnab; Lee, Ning-Cheng

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Solder joint reliability in AgPt-metallized LTCC modules
pp. 32-42(11)
Authors: Nousiaianen, Olli; Rautioaho, Risto; Kautio, Kari; Jääskeläinen, Jussi; Leppävuori, Seppo

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Application of a design of experiments approach to the reliability of a PBGA package
pp. 43-53(11)
Authors: Yang, Ji Hyuck; Lee, Kang Yong

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