Soldering & Surface Mount Technology

Fluxless plasma bumping of lead-free solders and the reliability effects of under bump metallization thickness
pp. 3-9(7)
Authors: Moon, Joon Kwon; Zhou, Y.; Jung, Jae Pil

Microstructural investigation of lead-free BGAs soldered with tin-lead solder
pp. 10-21(12)
Authors: Grossmann, Günter; Tharian, Joy; Jud, Pascal; Sennhauser, Urs

The impact of thermal cycling regime on the shear strength of lead-free solder joints
pp. 22-31(10)
Authors: Dusek, Milos; Wickham, Martin; Hunt, Christopher

A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environment
pp. 32-39(8)
Authors: Wable, Girish S.; Chu, Quyen; Damodaran, Purushothaman; Srihari, Krishnaswami

The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing
pp. 40-48(9)
Authors: Rizvi, M.J.; Chan, Y.C.; Bailey, C.; Lu, H.; Sharif, A.