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Publisher: Emerald Group Publishing Limited

Volume 17, Number 2, 2005

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Microstructural investigation of lead-free BGAs soldered with tin-lead solder
pp. 10-21(12)
Authors: Grossmann, G√ľnter; Tharian, Joy; Jud, Pascal; Sennhauser, Urs

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The impact of thermal cycling regime on the shear strength of lead-free solder joints
pp. 22-31(10)
Authors: Dusek, Milos; Wickham, Martin; Hunt, Christopher

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A systematic procedure for the selection of a lead-free solder paste in an electronics manufacturing environment
pp. 32-39(8)
Authors: Wable, Girish S.; Chu, Quyen; Damodaran, Purushothaman; Srihari, Krishnaswami

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The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing
pp. 40-48(9)
Authors: Rizvi, M.J.; Chan, Y.C.; Bailey, C.; Lu, H.; Sharif, A.

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