Soldering & Surface Mount Technology

Modelling the effect of voids in anisotropic conductive adhesive joints
pp. 4-12(9)
Authors: Lee K.K.; Yeung N.H.; Chan Y.C.

The effect of PCB surface finish on lead-free solder joints
pp. 13-23(11)
Authors: Nurmi Sami T; Sundelin Janne J; Ristolainen Eero O; Lepistö Toivo K

Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications
pp. 24-32(9)
Authors: Jackson G.J.; Hendriksen M.W.; Kay R.W.; Desmulliez M; Durairaj R.K.; Ekere N.N.

Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints
pp. 33-39(7)
Authors: Lee J.G.; Subramanian K.N.

Improving the reliability of a plastic IC package in the reflow soldering process by DOE
pp. 40-48(9)
Authors: Kim Geun Woo; Lee Kang Yong