Soldering & Surface Mount Technology

Dissolution rates of iron plating on soldering iron tips in molten lead-free solders
pp. 9-15(7)
Authors: Takemoto, Tadashi; Uetani, Takashi; Yamazaki, Morio

A study of SMT assembly processes for fine pitch CSP packages
pp. 16-21(6)
Authors: Arra, Minna; Geiger, David; Shangguan, Dongkai; Sj÷berg, Jonas

A comparison of the quality of lead-free solder pastes
pp. 22-30(9)
Authors: Sitek, Janusz; Rocak, Dubravka; Bukat, Krystyna; Fajfar-Plut, Janeta; Belavic, Darko

Dissolution of solids in contact with liquid solder
pp. 31-33(3)
Authors: Mannan, Samjid; Clode, Michael P.