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Publisher: Emerald Group Publishing Limited

Volume 16, Number 2, 2004

Editorial
pp. i-i(1)

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Internet commentary
pp. i-i(1)

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International diary
pp. ii-ii(1)

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New vacuum pickup
pp. vi-vi(1)

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New rotary dispensing table
pp. xiii-xiii(1)

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Lead-free soldering
pp. xxiii-xxiii(1)

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Long term mechanical reliability with lead-free solders
pp. 13-20(8)
Author: Plumbridge, W.J.

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Strategies for improving the reliability of solder joints on power semiconductor devices
pp. 27-40(14)
Authors: Lu, Guo-Quan; Liu, Xingsheng; Wen, Sihua; Calata, Jesus Noel; Bai, John G.

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CBGA solder joint thermal fatigue life estimation by a simple method
pp. 41-45(5)
Authors: Wong, T.E.; Lau, C.Y.; Fenger, H.S.

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Reliability testing and data analysis of lead-free solder joints for high-density packages
pp. 46-68(23)
Authors: Lau, John; Hoo, Nick; Horsley, Rob; Smetana, Joe; Shangguan, Dongkai; Dauksher, Walter; Love, Dave; Menis, Irv; Sullivan, Bob

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Failure analysis of lead-free solder joints for high-density packages
pp. 69-76(8)
Authors: Lau, John; Shangguan, Dongkai; Castello, Todd; Horsley, Rob; Smetana, Joe; Hoo, Nick; Dauksher, Walter; Love, Dave; Menis, Irv; Sullivan, Bob

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Thermal cycling reliability of lead-free chip resistor solder joints
pp. 77-87(11)
Authors: Suhling, Jeffrey C.; Gale, H.S.; Johnson, R. Wayne; Islam, M. Nokibul; Shete, Tushar; Lall, Pradeep; Bozack, Michael J.; Evans, John L.; Seto, Ping; Gupta, Tarun; Thompson, James R.

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