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Home / Soldering & Surface Mount Technology, Volume 16, Number 1

Reflow profile study of the Sn-Ag-Cu solder

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A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40 s for the RSS reflow profile and 50-70 s for the RTS reflow profile.

Keywords: Soldering; Surface Texture; Surface Treatment

Document Type: Research Article

Publication date: 20 February 2004

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