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Publisher: Emerald Group Publishing Limited

Volume 16, Number 1, 2004

Design for lead-free solder joint reliability of high-density packages
pp. 12-26(15)
Authors: Lau, John; Dauksher, Walter; Smetana, Joe; Horsley, Rob; Shangguan, Dongkai; Castello, Todd; Menis, Irv; Love, Dave; Sullivan, Bob

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Reflow profile study of the Sn-Ag-Cu solder
pp. 27-34(8)
Authors: Salam, B; Virseda, C; Da, H; Ekere, N.N.; Durairaj, R

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Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings
pp. 35-43(9)
Authors: Arra, Minna; Castello, Todd; Shangguan, Dongkai; Ristolainen, Eero

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The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow
pp. 44-47(4)
Authors: Liukkonen, Timo; Nummenpää, Pekka; Tuominen, Aulis

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Thermal fatigue cracking of surface mount conductive adhesive joints
pp. 48-52(5)
Authors: Mo, Zhimin; Lai, Zonghe; Li, Shiming; Liu, Johan

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Design, materials and process for lead-free assembly of high-density packages
pp. 53-62(10)
Authors: Smetana, Joe; Horsley, Rob; Lau, John; Snowdon, Ken; Shangguan, Dongkai; Gleason, Jerry; Memis, Irv; Love, Dave; Dauksher, Walter; Sullivan, Bob

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