Soldering & Surface Mount Technology

Design for lead-free solder joint reliability of high-density packages
pp. 12-26(15)
Authors: Lau J.; Dauksher W.; Smetana J.; Horsley R.; Shangguan D.; Castello T.; Menis I.; Love D.; Sullivan B.

Reflow profile study of the Sn-Ag-Cu solder
pp. 27-34(8)
Authors: Salam B.; Virseda C.; Da H.; Ekere N.N.; Durairaj R.

Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings
pp. 35-43(9)
Authors: Arra M.; Castello T.; Shangguan D.; Ristolainen E.

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow
pp. 44-47(4)
Authors: Liukkonen T.; Nummenpää P.; Tuominen A.

Thermal fatigue cracking of surface mount conductive adhesive joints
pp. 48-52(5)
Authors: Mo Z.; Lai Z.; Li S.; Liu J.

Design, materials and process for lead-free assembly of high-density packages
pp. 53-62(10)
Authors: Smetana J.; Horsley R.; Lau J.; Snowdon K.; Shangguan D.; Gleason J.; Memis I.; Love D.; Dauksher W.; Sullivan B.