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Publisher: Emerald Group Publishing Limited

Volume 15, Number 3, 2003

Improving the fatigue life of a bare die flip chip by thinning
pp. 8-14(7)
Authors: Alander, T.; Suominen, I.; Heino, P.; Ristolainen, E.

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Flip chip solder joint reliability under harsh environment
pp. 15-20(6)
Authors: Bo, Cheng; Li, Wang; Qun, Zhang; Xia, Gao; Xiaoming, Xie; Kempe, Wolfgang

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Mechanical characterization of Sn-3.5Ag solder joints at various temperatures
pp. 21-26(6)
Authors: Rhee, H.; Subramanian, K.N.; Lee, A.; Lee, J.G.

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Failures of flip chip assemblies under thermal shock
pp. 27-32(6)
Authors: Bo, Cheng; Li, Wang; Qun, Zhang; Xia, Gao; Xiaoming, Xie; Kempe, Wolfgang

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