Publisher: Emerald Group Publishing Limited

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Volume 15, Number 2, 2003

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Pb-free solder bumping for flip chip package by electroplating
pp. 10-16(7)
Authors: Hwang, Hyeon; Hong, Soon-Min; Jung, Jae-Pil; Kang, Choon-Sik

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Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping
pp. 17-21(5)
Authors: Tian, Yanhong; Wang, Chunqing; Zhang, Xiaodong; Liu, Deming

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Process characterization of PCB assembly using 0201 packages with lead-free solder
pp. 22-27(6)
Authors: Geiger, David; Mattsson, Fredrik; Shangguan, Dongkai; Ong, MT; Wong, Patrick; Wang, Mei; Castello, Todd; Yi, Sammy

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A novel measurement technique for stencil printed solder paste
pp. 35-45(11)
Authors: Dusˇek, Milosˇ; Hunt, Christopher

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Study of under bump metallisation barrier layer for lead-free solder
pp. 46-52(7)
Authors: Chan, K.C.; Zhong, Z.W.; Ong, K.W.

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