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Publisher: Emerald Group Publishing Limited

Volume 15, Number 1, 2003

Reducing bonding cycle time of adhesive flip chip process
pp. 16-20(5)
Authors: Seppälä, Anne; Aalto, Kati; Ristolainen, Eero

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Finite element analysis of a three-dimensional package
pp. 21-25(5)
Authors: Zhong, Zhaowei; Yip, Peng Kiong

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The analysis of creep data for solder alloys
pp. 26-30(5)
Author: Plumbridge, W.J.

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The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs
pp. 31-38(8)
Authors: Nurmi, S.T.; Sundelin, J.J.; Ristolainen, E.O.; Lepistö, T

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Creep behaviour of composite lead-free electronic solder joints
pp. 39-42(4)
Authors: Guo, F; Lee, J; Subramanian, K.N.

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Fine pitch stencil printing using enclosed printing systems
pp. 43-49(7)
Authors: Zou, Ling Chunxian; Dusek, Milos; Wickham, Martin; Hunt, Christopher

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Advanced alloy for lead-free solder balls
pp. 50-54(5)
Authors: Dittes, Marc; Walter, Hermann

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