Skip to main content

Publisher: Emerald Group Publishing Limited

Volume 15, Number 1, 2003

Reducing bonding cycle time of adhesive flip chip process
pp. 16-20(5)
Authors: Seppälä, Anne; Aalto, Kati; Ristolainen, Eero

Favourites:
ADD

Finite element analysis of a three-dimensional package
pp. 21-25(5)
Authors: Zhong, Zhaowei; Yip, Peng Kiong

Favourites:
ADD

The analysis of creep data for solder alloys
pp. 26-30(5)
Author: Plumbridge, W.J.

Favourites:
ADD

The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs
pp. 31-38(8)
Authors: Nurmi, S.T.; Sundelin, J.J.; Ristolainen, E.O.; Lepistö, T

Favourites:
ADD

Creep behaviour of composite lead-free electronic solder joints
pp. 39-42(4)
Authors: Guo, F; Lee, J; Subramanian, K.N.

Favourites:
ADD

Fine pitch stencil printing using enclosed printing systems
pp. 43-49(7)
Authors: Zou, Ling Chunxian; Dusek, Milos; Wickham, Martin; Hunt, Christopher

Favourites:
ADD

Advanced alloy for lead-free solder balls
pp. 50-54(5)
Authors: Dittes, Marc; Walter, Hermann

Favourites:
ADD

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Partial Open Access Content
Partial Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more