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Publisher: Emerald Group Publishing Limited

Volume 14, Number 3, 2002

Lead-free solder process implementation for PCB assembly
pp. 12-18(7)
Authors: Collier, Peter; Sunappan, Vasudivan; Periannan, Arulvanan

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Evaluation of two novel lead-free surface finishes
pp. 19-24(6)
Authors: Ludwig, Richard; Lee, Ning-Cheng; Fan, Chonglun; Zhang, Yun

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Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder
pp. 30-36(7)
Authors: Kanchanomai, C.; Miyashita, Y.; Mutoh, Y.; Mannan, S.L.

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Fatigue crack growth behaviour of lead-containing and lead-free solders
pp. 37-45(9)
Authors: Mutoh, Y.; Zhao, J.; Miyashita, Y.; Kanchanomai, C.

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Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
pp. 46-50(5)
Authors: Lee, Shi-Wei Ricky; Lui, Ben Hoi Wai; Kong, Y.H.; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector

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Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests
pp. 51-60(10)
Authors: Towashiraporn, P.; Subbarayan, G.; McIlvanie, B.; Hunter, B.C.; Love, D.; Sullivan, B.

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