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Publisher: Emerald Group Publishing Limited

Volume 14, Number 2, 2002

Intermetallic morphology around Ni particles in Sn-3.5Ag solder
pp. 11-17(7)
Authors: Lee, J.G.; Guo, F.; Subramanian, K.N.; Lucas, J.P.

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Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards
pp. 18-25(8)
Authors: Arra, Minna; Shangguan, Dongkai; Ristolainen, Eero; Lepistö, Toivo

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Reliability of tin-lead balled BGAs soldered with lead-free solder paste
pp. 35-39(5)
Authors: Nurmi, Sami Tapani; Ristolainen, Eero Olavi

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Solder ball failure mechanisms in plastic ball grid array packages
pp. 40-50(11)
Authors: Zhong, C.H.; Yi, S.; Whalley, D.C.

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