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Publisher: Emerald Group Publishing Limited
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Intermetallic morphology around Ni particles in Sn-3.5Ag solder
Lee, J.G.; Guo, F.; Subramanian, K.N.; Lucas, J.P.
Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards
Arra, Minna; Shangguan, Dongkai; Ristolainen, Eero; Lepistö, Toivo
A methodology to establish baseline metrics for assessing the isothermally aging of Sn-Pb solder interconnects
Vianco, P.T.; Rejent, J.A.
Reliability of tin-lead balled BGAs soldered with lead-free solder paste
Nurmi, Sami Tapani; Ristolainen, Eero Olavi
Solder ball failure mechanisms in plastic ball grid array packages
Zhong, C.H.; Yi, S.; Whalley, D.C.
Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging
Wu, C.M. Lawrence; Chau, M.L.