Skip to main content

Publisher: Emerald Group Publishing Limited

Volume 14, Number 1, 2002

Correlation of solder paste rheology with computational simulations of the stencil printing process
pp. 11-17(7)
Authors: Durairaj, R; Jackson, G.J.; Ekere, N.N.; Glinski, G; Bailey, C

Favourites:
ADD

Solder paste reflow modeling
pp. 18-23(6)
Author: Mannan, S.H.

Favourites:
ADD

Numerical modelling of scanned beam laser soldering of fine pitch packages
pp. 24-29(6)
Authors: Beckett, P.M.; Fleming, A.R.; Gilbert, J.M.; Whitehead, D.G.

Favourites:
ADD

A simplified model of the reflow soldering process
pp. 30-37(8)
Authors: Whalley, David C; Hyslop, Stuart M

Favourites:
ADD

CFD modelling of the flow field inside a reflow oven
pp. 38-44(7)
Authors: Yu, Hao; Kivilathti, Jorma

Favourites:
ADD

Analysis on solder ball shear testing conditions with a simple computational model
pp. 45-48(4)
Authors: Lee, S.W. Ricky; Huang, Xingjia

Favourites:
ADD

Optimisation modelling for flip-chip solder joint reliability
pp. 49-58(10)
Authors: Stoyanov, S; Bailey, C; Cross, M

Favourites:
ADD

  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more