Publisher: Emerald Group Publishing Limited

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Volume 13, Number 3, 2001

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Editorial
pp. i-i(1)

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PN launch event report
pp. iii-iii(1)

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International diary
pp. iv-iv(1)

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SSTC
pp. vii-vii(1)

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Smart Group. New Web page
pp. xii-xii(1)

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Marketing management
pp. xl-xl(1)

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Business development
pp. xli-xli(1)

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New Face at Nissei-Sangyo
pp. xlii-xlii(1)

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New company – new vision
pp. xxxiii-xxxiii(1)

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Product management
pp. xxxix-xxxix(1)

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Andrews resigns as ITRI CEO
pp. xxxvii-xxxvii(1)

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Ceramic chip scale package solder joint reliability
pp. 7-11(5)
Authors: Seyyedi, J.; Padgett, J.

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The effect of PECVD SiN moisture barrier layers on the degradation of a flip chip underfill material
pp. 12-15(4)
Authors: Kaltenpoth, G.; Siebert, W.; Xie, X-M.; Stubhan, F.

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Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders
pp. 16-20(5)
Authors: Ye, L.; Lai, Z.H.; Liu, J.; Thölén, A.

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Lead-free reflow soldering for electronics assembly
pp. 21-38(18)
Authors: Harrison, M.R.; Vincent, J.H.; Steen, H.A.H.

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