ISSN 0954-0911 (Print)
Publisher: Emerald Group Publishing Limited
A high-performance lead-free solder - the effects of In on 99.3Sn/0.7Cu
Hwang, Jennie S; Guo, Zhenfeng; Koenigsmann, Holger
Bending and twisting of cylindrical solder interconnections with creep
Lau, John H
Reliability of FCOB with and without encapsulation
Effects of Pb contamination on the eutectic Sn-Ag solder joint
Choi, S; Bieler, T.R.; Subramanian, K.N.; Lucas, J.P.
Critical factors affecting paste flow during the stencil printing of solder paste
Durairaj, R; Nguty, T.A.; Ekere, N.N.
Stud bump bond packaging with reduced process steps