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Publisher: Emerald Group Publishing Limited

Volume 13, Number 2, 2001

A high-performance lead-free solder - the effects of In on 99.3Sn/0.7Cu
pp. 7-13(7)
Authors: Hwang, Jennie S; Guo, Zhenfeng; Koenigsmann, Holger

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Reliability of FCOB with and without encapsulation
pp. 21-25(5)
Author: Zhong, Zhaowei

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Effects of Pb contamination on the eutectic Sn-Ag solder joint
pp. 26-29(4)
Authors: Choi, S; Bieler, T.R.; Subramanian, K.N.; Lucas, J.P.

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Critical factors affecting paste flow during the stencil printing of solder paste
pp. 30-34(5)
Authors: Durairaj, R; Nguty, T.A.; Ekere, N.N.

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Stud bump bond packaging with reduced process steps
pp. 35-38(4)
Author: Zhong, Zhaowei

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