ISSN 0954-0911 (Print)
Publisher: Emerald Group Publishing Limited
Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders
Guo, F; Choi, S; Lucas, J.P.; Subramanian, K.N.
The solvent of choice
Lawrence, Tim; Wilding, Ian; Chowdhary, Balvinder
The effects of bump height on the reliability of ACF in flip-chip
Wu, C.M.L.; Liu, Johan; Yeung, N.H.
Design, coordination and control of hybrid factories: research issues from an exploratory field study
Doerr, Ken; Magazine, Michael J
Tin pest in lead-free solders
Kariya, Yoshiharu; Gagg, Colin; Plumbridge, William J