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Publisher: Emerald Group Publishing Limited

Volume 13, Number 1, 2001

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The solvent of choice
pp. 19-25(7)
Authors: Lawrence, Tim; Wilding, Ian; Chowdhary, Balvinder

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The effects of bump height on the reliability of ACF in flip-chip
pp. 25-30(6)
Authors: Wu, C.M.L.; Liu, Johan; Yeung, N.H.

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Tin pest in lead-free solders
pp. 39-40(2)
Authors: Kariya, Yoshiharu; Gagg, Colin; Plumbridge, William J

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