Soldering & Surface Mount Technology

Pb free – time to prepare
pp. i-i(1)

Brighton 2000 The SMART Group European Surface Mount Conference
pp. i-i(1)

APEX exhibit floor sells out
pp. i-i(1)

Alpha launch new paste on the Web
pp. i-i(1)

Metcal CD-ROM for BGA rework and repair know-how
pp. i-i(1)

Belief in progress is a doctrine of the lazy
pp. i-i(1)

The SMART Group Annual General Meeting
pp. ii-ii(1)

Assembly and reliability of lead-free solders headline APEX conference
pp. ii-ii(1)

Printer with automatic vision alignment
pp. ii-ii(1)

Q1 year 2000: top 40 European CEM ranking
pp. ii-ii(1)

Conformal coating workshop, 6 June 2000
pp. iii-iii(1)

Keynote speaker Dr Robert Ballard to focus on success at APEX 2001
pp. iii-iii(1)

Combined AOI/AXI inspection system recognises both visible and hidden faults on circuit boards
pp. iii-iii(1)

TFI releases forecasts for M&A activity through 2001 and beyond
pp. iii-iii(1)

Brighton 2000: opportunities and challenges into the future for electronics manufacturing
pp. iv-iv(1)

WESCON Spring 2001 and new EtroniX event co-locate to provide solutions across the supply chain
pp. iv-iv(1)

New HSP knowledge base now available on line
pp. iv-iv(1)

SIR testing and the performance of conformal settings
pp. iv-iv(1)

IPC announces dates for Autumn AMRC/TMRC meetings
pp. v-v(1)

SMT/ES&S/2000 Hybrid final report
pp. v-v(1)

Vitronics Soltec integrates ECD AutoM.O.L.E. technology into wave and reflow soldering systems
pp. v-v(1)

Lead-free visual inspection guidelines available
pp. v-v(1)

New IPC standard ends confusion for defect opportunities in benchmarking
pp. vi-vi(1)

Productronica 1999: results of the exhibitor and visitor survey
pp. vi-vi(1)

Lackwerke Peters introduce variable cure conformal coating
pp. vi-vi(1)

SMTA awards announced
pp. vii-vii(1)

SMT/ES&S/Hybrid 2001
pp. vii-vii(1)

No need to place wrong parts ever again?
pp. vii-vii(1)

MV Technology announces new manufacturing facilities
pp. viii-viii(1)

Adhesives in electronics network launch education offensive
pp. viii-viii(1)

LeadScan sensing system makes PMJ's odd-form assembly cells even better
pp. viii-viii(1)

Flextronics international announces two-for-one stock split
pp. ix-ix(1)

Seminars, workshops and tutorials
pp. ix-ix(1)

Vitronics Soltec's Flux Management(TM) ensures clean, efficient reflow processing
pp. ix-ix(1)

Flextronics international and Chatham Technologies sign definitive merger agreement
pp. x-x(1)

International diary
pp. x-x(1)

Siplace S and Siplace F introduce placement head modularity
pp. x-x(1)

Saunders Technology announces acquisition by ECD
pp. xi-xi(1)

Juki takes component placement into the 21st century
pp. xi-xi(1)

PMJ acquires Greenhill Oy
pp. xii-xii(1)

Mydata introduces MYLabel for increased component traceability
pp. xii-xii(1)

AIM and Crossflow International form collaborative venture
pp. xiii-xiii(1)

Versatile new soldering and desoldering machines from Zevac
pp. xiii-xiii(1)

Leica Microsystems plans initial public offering
pp. xiv-xiv(1)

Revolutionary PDM suite bridges CAD-MRP domains, delivering first comprehensive solution to product life-cycle management
pp. xiv-xiv(1)

Metcal signs up Nisus
pp. xv-xv(1)

ECD's Profile Planner(TM) programme provides robust profile generation solution
pp. xv-xv(1)

Valor and Orbotech to develop reference data interface
pp. xvi-xvi(1)

New Loctite adhesive in Pro Flow cartridge eliminates waste
pp. xvi-xvi(1)

GenRad reorganises worldwide
pp. xvii-xvii(1)

User-friendly AOI system for pre-reflow inspection
pp. xvii-xvii(1)

Strong support for Eastern Europe
pp. xviii-xviii(1)

Faster electrical potting and sealing with new light curing adhesives
pp. xviii-xviii(1)

GenRad announces completion of autodiagnos AB acquisition
pp. xix-xix(1)

Orbotech introduces new AOI series for electronics assembly manufacturing
pp. xix-xix(1)

Humiseal to be manufactured in Europe by Concoat
pp. xx-xx(1)

New OSP-1 advanced programmable clinch option for odd-form placement
pp. xx-xx(1)

Specifying entire lines stress-free
pp. xxi-xxi(1)

PMJ launches HiSAC 1502 final assembly cell
pp. xxi-xxi(1)

Philips EMT's
pp. xxii-xxii(1)

Heraeus PD966 high speed adhesive
pp. xxii-xxii(1)

Loctite to acquire Dexter speciality Polymers business
pp. xxiii-xxiii(1)

New high speed surface mount adhesive for difficult to bond applications
pp. xxiii-xxiii(1)

Mydata announces new agent for Scotland
pp. xxiv-xxiv(1)

Multicore solders introduces new lead-free no-clean solder paste for SMT assembly
pp. xxiv-xxiv(1)

NPL seek cleaning project equipment partners for new project
pp. xxv-xxv(1)

Tip for tight testing
pp. xxv-xxv(1)

ATF appoint Leed Automation exclusively in UK
pp. xxvi-xxvi(1)

Concoat develops unique water-based Humiseal coating
pp. xxvi-xxvi(1)

DEK consolidates in Central Europe
pp. xxvii-xxvii(1)

Mydata releases CAD Conversion 4.0 for easier conversion
pp. xxvii-xxvii(1)

Tecnomatix and Orbotech announce cooperation on new quality management software solution
pp. xxviii-xxviii(1)

Techspray(TM) introduces new ESD-safe packaging for desoldering braid
pp. xxviii-xxviii(1)

Two electronics industry marketing firms announce strategic partnership
pp. xxix-xxix(1)

NPL meeting keeps the industry informed
pp. xxx-xxx(1)

Wally Rubin receives prestigious IPC award
pp. xxxi-xxxi(1)

European study casts doubts on current SIR testing
pp. xxxii-xxxii(1)

Dross Recovery System
pp. xxxiii-xxxiii(1)

PAF-Dessouter application story
pp. xxxiv-xxxiv(1)

www.whichcompany.net Launch
pp. xxxv-xxxv(1)

Orbotech appoints European marketing manager for electronics assembly division
pp. xxxvi-xxxvi(1)

Organisational changes at PMJ
pp. xxxvii-xxxvii(1)

Fischthal joins Quad Systems as product manager
pp. xxxviii-xxxviii(1)

Quad names Perrotta vice president, technical services and support
pp. xxxix-xxxix(1)

Stencil design for mixed technology through-hole/SMT placement and reflow
pp. 8-12(5)
Authors: Coleman, William E.; Jean, Denis; Bradbury-Bennett, Julie R.

A study of solder paste printing requirements for CSP technology
pp. 13-19(7)
Author: Kennedy, Jeff

The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT
pp. 19-24(6)
Authors: Zhu, Qinong; Sheng, Mei; Luo, Le

On the degradation of the solder joints of underfilled flip chip packages: a case study
pp. 24-28(5)
Authors: Qun, Zhang; Xiaoming, Xie; Liu, Chen; Guozhong, Wang; Zhaonian, Cheng; Kempe, Wolfgang

Development and validation of lead-free wave soldering process
pp. 29-34(6)
Authors: Forstén, Atso; Steen, Hector; Wilding, Ian; Friedrich, Jürgen

Rework of CSP: the effect on surface intermetallic growth
pp. 35-38(4)
Authors: Nguty, T.A.; Ekere, N.N.; Philpott, J.D.; Jones, G.D.