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Publisher: Emerald Group Publishing Limited

Volume 12, Number 3, 2000

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SMTA awards announced
pp. vii-vii(1)

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SMT/ES&S/Hybrid 2001
pp. vii-vii(1)

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International diary
pp. x-x(1)

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PMJ acquires Greenhill Oy
pp. xii-xii(1)

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Metcal signs up Nisus
pp. xv-xv(1)

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GenRad reorganises worldwide
pp. xvii-xvii(1)

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Philips EMT's
pp. xxii-xxii(1)

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Tip for tight testing
pp. xxv-xxv(1)

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Dross Recovery System
pp. xxxiii-xxxiii(1)

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PAF-Dessouter application story
pp. xxxiv-xxxiv(1)

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www.whichcompany.net Launch
pp. xxxv-xxxv(1)

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Organisational changes at PMJ
pp. xxxvii-xxxvii(1)

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Stencil design for mixed technology through-hole/SMT placement and reflow
pp. 8-12(5)
Authors: Coleman, William E.; Jean, Denis; Bradbury-Bennett, Julie R.

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On the degradation of the solder joints of underfilled flip chip packages: a case study
pp. 24-28(5)
Authors: Qun, Zhang; Xiaoming, Xie; Liu, Chen; Guozhong, Wang; Zhaonian, Cheng; Kempe, Wolfgang

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Development and validation of lead-free wave soldering process
pp. 29-34(6)
Authors: Forstén, Atso; Steen, Hector; Wilding, Ian; Friedrich, Jürgen

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Rework of CSP: the effect on surface intermetallic growth
pp. 35-38(4)
Authors: Nguty, T.A.; Ekere, N.N.; Philpott, J.D.; Jones, G.D.

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