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Publisher: Emerald Group Publishing Limited

Volume 12, Number 2, 2000

Wettability test method for surface mount technology assessment
pp. 10-15(6)
Authors: Tu, C.C.; Natishan, M.E.

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Solder joint reliability of plastic ball grid array with solder bumped flip chip
pp. 16-23(8)
Authors: Lee, Shi-Wei Ricky; Lau, John H

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Viscoplastic Anand model for solder alloys and its application
pp. 31-36(6)
Authors: Cheng, Z.N.; Wang, G.Z.; Chen, L; Wilde, J; Becker, K

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The impact of underfill properties on the thermomechanical reliability of FCOB assembly
pp. 37-41(5)
Authors: Lu, Jicun; Wu, Jianhua; Liew, Yih Pin; Lim, Thiam Beng; Zong, Xiangfu

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TBGA reliability in telecom environment
pp. 42-47(6)
Authors: Pennanen, Virpi; Tammenmaa, Markku; Reinikainen, Tommi; Zhu, Jiansen; Lin, Wei

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