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Publisher: Emerald Group Publishing Limited

Volume 12, Number 1, 2000

Investigation of a solder bumping technique for flip-chip interconnection
pp. 7-14(8)
Authors: Hutt, David A; Rhodes, Daniel G; Conway, Paul P; Mannan, Samjid H; Whalley, David C; Holmes, Andrew S

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Reliability of unencapsulated SMD plastic film capacitors
pp. 15-22(8)
Authors: Seppälä, Anne; Saarinen, Kimmo; Ristolainen, Eero

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Lead-free solders in Japan (a personal impression)
pp. 32-34(3)
Author: Plumbridge, W.J.

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3D Si-:on-:Si stack packaging
pp. 35-39(5)
Authors: Kanbach, H; Wilde, J; Kriebel, F; Meusel, E

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A novel high performance die attach
pp. 40-44(5)
Authors: Xie, X.M.; Wang, T.B.; Shi, J.Z.; Ye, R.Q.; Stubhan, F; Freytag, J

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