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Publisher: Emerald Group Publishing Limited

Volume 11, Number 3, 1999

Editorial
pp. i-i(1)

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International diary
pp. ii-ii(1)

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SMART Group Ireland
pp. vi-vi(1)

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ProFlow continues to evolve
pp. xxiii-xxiii(1)

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New MRSI European office opens
pp. xxviii-xxviii(1)

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Survey of rework practices in the UK electronics assembly industry
pp. 12-22(11)
Authors: Wickham, M.; Hunt, C.P.

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Characterization of a solder paste printing process and its optimization
pp. 23-26(4)
Authors: Poon, Gary K.K.; Williams, D.J.

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Analysis of crack growth in solder joints
pp. 27-32(6)
Author: Shangguan, Dongkai

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Enhancement of underfill encapsulants for flip-chip technology
pp. 33-39(7)
Authors: Vincent, M.B.; Wong, C.P.

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PBGA solder ball coplanarity impact evaluation
pp. 40-45(6)
Authors: Huang, Tony; Chu, Joe

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Interfacial reactions of tin-zinc-bismuth alloys
pp. 46-52(7)
Author: Harris, Paul

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