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Publisher: Emerald Group Publishing Limited

Volume 11, Number 2, 1999

Novel techniques for electronic component removal
pp. 7-11(5)
Authors: Stennett, A.D.; Whalley, D.C.

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TMA, DMA, DSC and TGA of lead free solders
pp. 17-24(8)
Authors: Lau, John H; Chang, Chris

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CSP compatibility in the SMT assembly process
pp. 25-29(5)
Authors: Chen, L Alex; Sterian, Irene; Smith, Brian; Kirkpatrick, Damien

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Surface insulation resistance (SIR) response to various processing parameters
pp. 30-34(5)
Authors: Zou, Ling; Hunt, Christopher

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