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Publisher: Emerald Group Publishing Limited

Volume 11, Number 1, 1999

Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assembly
pp. 8-12(5)
Authors: Firmstone, M.G.; Bartholomew, P.M.; Lowrie, D.J.J.; Mannan, S.H.; Hutt, D.A.

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Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests
pp. 21-26(6)
Authors: Tuominen, Aulis; Ristolainen, Eero; Lehtinen, Ville

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An evaluation of the effect of ageing on the cleanability of solder flux residues
pp. 27-35(9)
Authors: Zou, L; Duˇsek, M; Hunt, C.P.; Dunn, B.D.

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Solder joint reliability of plastic ball grid array packages
pp. 44-48(5)
Authors: Zhong, Chong Hua; Yi, Sung

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