Publisher: Emerald Group Publishing Limited

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Volume 10, Number 3, 1998

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Influences of storage conditions on component cracking
pp. 6-11(6)
Authors: Feldmann, Klaus; Feuerstein, Robert; Götz, Knuth

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Finite element modelling of printed circuit boards (PCBs) for structural analysis
pp. 12-17(6)
Authors: Lee, Miky; Centre, Production Engineering Research; Inc, LG Electronics; Pyungtaik; Korea

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Gallium-based interconnects for flip-chip assembly
pp. 18-22(5)
Author: Stanfield, Adam A

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Verification of flip-chip assembly on FR4 boards
pp. 23-28(6)
Authors: Beelen-Hendrikx, Caroline; Verguld, Martin

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The role of intermetallic compounds in lead-free soldering
pp. 38-52(15)
Authors: Harris, Paul G; Chaggar, Kaldev S

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