Publisher: Emerald Group Publishing Limited

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Volume 10, Number 1, 1998

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Microstructure of solder joints with electronic components in lead-free solders
pp. 10-12(3)
Authors: Nakamura, Yoshikazu; Sakakibara, Yoshinori; Watanabe, Yoshihisa; Amamoto, Yoshiki

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The application of IR thermography to process monitoring and control of reflow soldering
pp. 13-18(6)
Authors: Conway, Paul; Whalley, David; Wilkinson, Michelle; S.M.Hyslop

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Lead-free alloys
pp. 19-25(7)
Authors: Miric, Anton Zoran; Grusd, Angela

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Solder joint reliability of cavity-down plastic ball grid array assemblies
pp. 26-31(6)
Authors: Lee, S.-W. Ricky; Lau, John H

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Surface mount assembly of BGA and μBGA
pp. 32-36(5)
Author: Koch, Volker-Ekkehart

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Mechanical properties of Pb/Sn Pb/In and Sn-In solders
pp. 37-41(5)
Authors: Jones, W Kinzy; Liu, Yanqing; Shah, Milind; Clarke, Robert

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