Soldering & Surface Mount Technology

Lead-free and No-clean Solderingfor Automotive Electronics*
pp. 5-8(4)
Authors: Shangguan, D; Gao, G

MicrostructuralInvestigation of Sn-Ag and Sn-Ag Solder Joints*
pp. 9-13(5)
Authors: Chada, S; Herrmann, A; Laub, W; Fournelle, R; Shangguan, D; Achari, A

An Experimental Method for Refinement ofSolderability Measurement*
pp. 14-21(8)
Authors: Liggett, W; Moon, K.-W.; Handwerker, C

Hard-particle Reinforced Composite SoldersPart 1: Microcharacterisation
pp. 22-28(7)
Authors: Marshall, J.L.; Calderon, J

The Development of High Speed Printing SolderPastes for Fine Pitch Applications*
pp. 29-32(4)
Authors: M.Warwick,; Harpley, I

Solder Reliability Solutions: APC-based Design-for-reliability Tool*
pp. 45-54(10)
Author: CIech, J.-P.

New High Thermal Conductivity Thermoplastics forPower Applications*
pp. 55-57(3)
Authors: Dietz, R L; Peck, D; Robinson, P J; Firmstone, M G; Bartholomew, P.M.; Paterson, G

The Roles of DNP (Distance to Neutralpoint) on Solder Joint Reliability of Area Array Assemblies
pp. 58-60(3)
Author: Lau, J H .

Microstructural Modelling and ElectronicInterconnect Reliability*
pp. 61-64(4)
Authors: Winter, P R; Wallach, E R

Getting Ready for Lead-free Solders*
pp. 65-69(5)
Author: Lee, N.-C.