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Publisher: Emerald Group Publishing Limited

Volume 9, Number 2, 1997

Lead-free and No-clean Soldering for Automotive Electronics*
pp. 5-8(4)
Authors: Shangguan, D; Gao, G

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Microstructural Investigation of Sn-Ag and Sn-Ag Solder Joints*
pp. 9-13(5)
Authors: Chada,, S; Herrmann,, A; Laub,, W; Fournelle,, R; Shangguan**, D; Achari**, A

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An Experimental Method for Refinement of Solderability Measurement*
pp. 14-21(8)
Authors: Liggett,, W; Moon, K.-W.; Handwerker, C

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Hard-particle Reinforced Composite Solders Part 1: Microcharacterisation
pp. 22-28(7)
Authors: Marshall, J.L.; Calderon, J

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New High Thermal Conductivity Thermoplastics for Power Applications*
pp. 55-57(3)
Authors: Dietz,, R L; Peck,, D; Robinson,, P J; Firmstone,**, M G; Bartholomew**, P.M.; Paterson**, G

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Microstructural Modelling and Electronic Interconnect Reliability*
pp. 61-64(4)
Authors: Winter, P R; Wallach, E R

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Getting Ready for Lead-free Solders*
pp. 65-69(5)
Author: Lee, N.-C.

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