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Publisher: Emerald Group Publishing Limited

Volume 9, Number 1, 1997

Capillary Flow Solder Wettability Test*
pp. 4-7(4)
Authors: Vianco, P.T.; Rejent, J.A.

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Closed Loop Control of Atmospheres for Soldering*
pp. 8-10(3)
Authors: Saxena,, N; Precious**,, C; Carr**, A; Adams***, S

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Some Problems in Switching to Lead-free Solders*
pp. 11-12(2)
Author: W.B.Hampshire

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Heated Gas Jet Reflow: An Alternative Reflow Solder Assembly Process Technology*
pp. 13-16(4)
Authors: Lichtenberg, L R; Gillespie, P J

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Mass Soldering
pp. 23-29(7)
Author: Becker, G

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Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*
pp. 39-42(4)
Authors: Frear, D.R.; Burchett, S.N.; Neilsen, M.K.; Stephens, J.J.

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