Skip to main content

Publisher: Emerald Group Publishing Limited

Volume 8, Number 2, 1996

Fluxless Flip-chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering*
pp. 5-11(7)
Authors: Aschenbrenner, R; Zakel, E; Azdasht**, G; Kloeser, A; H.Reichl

Favourites:
ADD

Novel Application of Diffusion Soldering*
pp. 12-15(4)
Authors: Jacobson, D.M.; Sangha, S.P.S

Favourites:
ADD
Favourites:
ADD

Screen Printing is a Science, not an Art
pp. 25-28(4)
Author: Phail, D Mc

Favourites:
ADD

Reliability Evaluation of TSOP Solder Joints for PC Card Application
pp. 29-32(4)
Authors: Seyyedi, J; lannuzzelli, R; Bukhari, J

Favourites:
ADD

Access Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more