Publisher: Emerald Group Publishing Limited

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Volume 8, Number 2, 1996

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Fluxless Flip-chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering*
pp. 5-11(7)
Authors: Aschenbrenner, R; Zakel, E; Azdasht**, G; Kloeser, A; H.Reichl

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Novel Application of Diffusion Soldering*
pp. 12-15(4)
Authors: Jacobson, D.M.; Sangha, S.P.S

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Screen Printing is a Science, not an Art
pp. 25-28(4)
Author: Phail, D Mc

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Reliability Evaluation of TSOP Solder Joints for PC Card Application
pp. 29-32(4)
Authors: Seyyedi, J; lannuzzelli, R; Bukhari, J

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