ISSN 1356-5362 (Print)
Publisher: Emerald Group Publishing Limited
Assembly and Reliability of Very Large Flip-chip on CQFP* pp. 5-8(4) Authors: Clementi, J J; Dearing**, G 0; Bergeron***, C
Thick Film Microchannels: Design and Fabrication pp. 9-12(4) Authors: Filippini, D; Fraigi, L; Gwirc, S
Characterisation of Polyimide-glass-metal Joints Bonded with Anisotropic Electrically Conductive Adhesives pp. 13-16(4) Authors: Savolainen, P; Kivilahti, J
Design Optimisation of Integrated Circuit Thin-film Resistors with Slits and Curved Boundaries pp. 17-21(5) Author: Chaudhry, Maqsood A
Acceleration Factors for Thick Film Gold Conductors on Ceramic for Temperature, Humidity and Bias Testing pp. 22-26(5) Authors: Kripesh,, V; Bhatnagar,*, S K; Osterwinter**, H; Gust, W
Minimal Size Packaging Solutions: A Comparison pp. 27-32(6) Author: Greathouse, S
Electroless Bumped Bare Dice on Flexible Substrates* pp. 49-52(4) Author: Björklöf, A
SPECIAL REPORT European Microelectronics Activities - Nordic Countries and Central and Eastern Europe pp. 53 Author: Nørlyng, S
Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC pp. 54-56(3) Author: Lyszio, W
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