ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
How to make chip integration technology suitable for high volume production pp. 3-8(6) Authors: Gottwald, Thomas; Ockenfuß, Ulrich
Modeling of multi-layer circuit boards by using a model of bi-phase and elasto-plastic plies pp. 9-20(12) Authors: Low, K.H.; Wang, Yuqi
Prognostics of ceramic capacitor temperature-humidity-bias reliability using Mahalanobis distance analysis pp. 21-28(8) Authors: Nie, Lei; Azarian, Michael H.; Keimasi, Mohammadreza; Pecht, Michael
The evaluation of sonochemical techniques for sustainable surface modification in electronic manufacturing pp. 29-34(6) Authors: Cobley, Andy; Mason, Tim
The importance of standards for PCBs when doing business in Europe pp. 35-37(3) Author: Weinhold, Michael
Chemical characterisation of materials in electronic systems using infrared spectroscopy pp. 38-47(10) Author: Smith, C.A.
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