ISSN 0305-6120 (Print)
Publisher: Emerald Group Publishing Limited
Intermetallic compound formation and solderability for immersion tin pp. 3-8(6) Authors: Chan, C.M.; Tong, K.H.; Kwok, R.W.M.
Influence of the binder system on current and future demands for base materials pp. 9-14(6) Authors: Hoevel, Bernd; Valette, Ludovic; Aoyama, Tomoyuki
Can laser direct imaging (LDI) meet the needs of high density interconnect (HDI) mass-production and packaging manufacturers? pp. 15-18(4) Author: Altmann, Uwe
New technologies for a sustainable printed circuit board manufacturing process: further results pp. 19-24(6) Authors: Bains, Narinder; Geraghty, Kate; Goosey, Martin
European printed circuit board (PCB) technology and environmental trends: their impact on PCB supply from China pp. 25-27(3) Author: Weinhold, Michael K.
Technology roadmapping and the supply chain pp. 28-31(4) Author: Fisher, John T. (Jack)
Brominated flame retardants: their potential impacts and routes into the environment pp. 32-35(4) Author: Goosey, Emma
The influence of temperature on the efficiency of electroplating from various ionic liquids pp. 36-41(6) Author: Lambert, Stuart
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