Circuit World

Calculation of PCB track impedance
pp. 6-10(5)
Authors: Burkhardt, Andrew J; Gregg, Christopher S; Staniforth, J Alan

Laser (UV) microvia application in cellular technology
pp. 11-15(5)
Authors: Raman, Sudhakar; Jeong, Jae Hun; Kim, Sang Jin; Sun, Ben; Park, Keon-Yang

Utilizing thermal fatigue testing to differentiate the performance of epoxy materials at various glass transition temperature levels
pp. 16-18(3)
Author: Reutzel, Kathleen M

FLINT - fine line interconnect - project: development of technologies for the production of HDI-boards
pp. 19-21(3)
Authors: Griesinger, Andreas; Guenther, Bernd

Thermal reliability of high density interconnects utilizing microvias and standard through-hole technologies
pp. 22-26(5)
Authors: Young, Todd; Carano, Mike; Polakovic, Frank

An accurate method for measuring the dielectric constant of printed wiring board materials
pp. 27-32(6)
Author: Paulter, N.G.