Abstract:

<B>Purpose</B> - To numerically model forced convection heat transfer over arrays of solder balls. <B>Design/methodology/approach</B> - The characteristic based split (CBS) scheme has been used to solve the incompressible Navier-Stokes equations on unstructured meshes. <B>Findings</B> - The results show an increase in heat transport with increase in Reynolds numbers. A significant change in heat transfer is also noticed with change in angle of attack. <B>Originality/value</B> - The presented results will be useful in designing cooling systems for electronic components.

Keywords: Convection; Heat transfer; Solder

Document Type: Research article

DOI: 10.1108/09615530510571967