Authors: Nithiarasu, P.; Massarotti, N.; Mathur, J.S.

Source: International Journal of Numerical Methods for Heat & Fluid Flow, Volume 15, Number 1, 2005 , pp. 73-95(23)

Publisher: Emerald Group Publishing Limited

Abstract:

<B>Purpose</B> - To numerically model forced convection heat transfer over arrays of solder balls. <B>Design/methodology/approach</B> - The characteristic based split (CBS) scheme has been used to solve the incompressible Navier-Stokes equations on unstructured meshes. <B>Findings</B> - The results show an increase in heat transport with increase in Reynolds numbers. A significant change in heat transfer is also noticed with change in angle of attack. <B>Originality/value</B> - The presented results will be useful in designing cooling systems for electronic components.

Keywords: Convection; Heat transfer; Solder

Document Type: Research article

DOI: http://dx.doi.org/10.1108/09615530510571967

Publication date: 2005-01-01

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