Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme

Authors: Nithiarasu, P; Massarotti, N; Mathur, J.S.

Source: International Journal of Numerical Methods for Heat & Fluid Flow, Volume 15, Number 1, 2005 , pp. 73-95(23)

Publisher: Emerald Group Publishing Limited

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Abstract:

Purpose - To numerically model forced convection heat transfer over arrays of solder balls. Design/methodology/approach - The characteristic based split (CBS) scheme has been used to solve the incompressible Navier-Stokes equations on unstructured meshes. Findings - The results show an increase in heat transport with increase in Reynolds numbers. A significant change in heat transfer is also noticed with change in angle of attack. Originality/value - The presented results will be useful in designing cooling systems for electronic components.

Keywords: Convection; Solder; Heat Transfer

Document Type: Research article

DOI: 10.1108/09615530510571967

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