The contribution of thermoreflectance to high resolution thermal mapping
Thermal phenomena that occur in operating integrated circuits can disturb their functioning and even cause failures. In order to prevent such dramatic issues, it is necessary to study these phenomena by developing high-resolution thermal mapping of electronic devices. This can be done by using the thermoreflectance technique. The principle of thermoreflectance measurements is reviewed and various experimental setups are described. Experimental results show that this technique allows the mapping of both low and high frequency thermal phenomena at submicron scales.
Keywords: Integrated Circuits; Non-Destructive Testing; Thermal Testing
Document Type: Research Article
Publication date: 05 February 2003
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