Simulation of capacitor discharge stud welding process and void formation

Authors: Oh, H. S.; Lee, J. H.; Yoo, C. D.

Source: Science and Technology of Welding & Joining, Volume 12, Number 3, April 2007 , pp. 274-281(8)

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Abstract:

Dynamic behaviour and void formation of the capacitor discharge (CD) stud welding process are investigated through simulation and experiments. Mechanical and electrical models are coupled to predict the current and voltage waveform of the stud welding, and the calculated results show good agreement with the experiment results. The mechanism of void formation and the void trapping condition are explained using the void flow model. While the results of the void flow model show that removal of the void is almost impossible, partial improvement in void reduction is achieved by adjusting the short circuit current between 1200 and 1700 A.

Keywords: VOID FORMATION; CD STUD WELDING; MODELLING; VOID REDUCTION

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174329307X166803

Publication date: 2007-04-01

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