Authors: Huang, C. Y.; Wu, Z. H.; Zhou, D. J.

Source: Science and Technology of Welding & Joining, Volume 12, Number 1, January 2007 , pp. 100-105(6)

Publisher: Maney Publishing

Abstract:

Based on the minimal energy principle, the shape prediction models of the 0·5 mm pitch, 16 pin quad flat no lead (QFN) package solder joints were developed. The influence of the process parameters including the pad length, the pad width and the stand-off on the solder joint shape of QFN was studied. Utilising the surface coordinate exported from the QFN solder joint shape prediction models, finite element analysis (FEA) models were set up and then the non-linear FEA of the QFN solder joints under thermal cycles was performed by ANSYS. The stress–strain distribution within the solder joints and the maximum strain range of the solder joint were determined. The thermal fatigue life of the QFN solder joint was calculated based on the maximum strain range and the Coffin–Manson equation. The results show that the process parameters influence the QFN solder joint shape distinctly, and the QFN solder joint with different pad lengths, pad widths and stand-offs has various stress–strain distributions and fatigue life. The QFN solder joint with a pad length of 0·7 mm, a pad width of 0·28 mm and a stand-off of 0·125 has a fatigue life of 252 cycles under thermal cycles.

Keywords: QUAD FLAT NO LEAD; FINITE ELEMENT ANALYSIS; PROCESS PARAMETERS; SOLDER JOINT SHAPE; FATIGUE LIFE

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/174329306X131857

Publication date: 2007-01-01

More about this publication?

• Now online only
  
  Authors wishing to cite fast track papers should give the journal name and the article DOI. This will enable reference linking via CrossRef and allow forward and backward citation tracking systems to associate the fast track citation with the final journal reference.

  This journal features top 10 articles which are freely available. Please click here and click on the 'Top articles' link in the right-hand menu to view the list and start downloading.

• Editorial Board
• Information for Authors
• Subscribe to this Title
• Terms & Conditions
• Online submission site
• Top 10 Articles
• ingentaconnect is not responsible for the content or availability of external websites

Related content

• In this: publication
• By this: publisher
• In this Subject: Materials & Manufacturing ,  Mining & Metallurgy
• By this author: Huang, C. Y. ;  Wu, Z. H. ;  Zhou, D. J.

Website © Publishing Technology. Article copyright remains with the publisher, society or author(s) as specified within the article.

• Terms and conditions
• Privacy policy
• Information for advertisers