Temperature gradient transient liquid phase diffusion bonding: a new method for joining advanced materials
Authors: Shirzadi, A. A.; Wallach, E. R.
Source: Science and Technology of Welding & Joining, Volume 2, Number 3, June 1997 , pp. 89-94(6)
Publisher: Maney Publishing
Abstract:A novel method for transient liquid phase (TLP) diffusion bonding of aluminium based materials has been developed which is capable of reliably providing excellent bonds with parent material shear strengths. This new method relies on imposing a temperature gradient across the bond line during TLP diffusion bonding and this leads to the formation of sinusoidal or cellular interfaces. Consequently, bond strengths are increased, possibly as a result of the higher metal–metal contact along the non-planar interfaces compared with the planar interfaces associated with either conventional TLP or solid state diffusion bonding processes. This paper describes the results achieved, implementing the new method and using copper interlayers, when joining Al–Mg–Si, Al–Li alloys, and an aluminium metal matrix composite with SiC particles. Patent protection has been filed in the UK under UK Patent No. 9709167.2.
Document Type: Research Article
Affiliations: Department of Materials Science and Metallurgy, University of Cambridge, Pembroke Street, Cambridge CE2 3QZ
Publication date: June 1997
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