Home >> Surface Engineering, Volume 25, Number 8

Pulse electrodeposition of tin from sulphate bath

Authors: Mohan, S.1; Rajasekaran, N.2

Source: Surface Engineering, Volume 25, Number 8, November 2009 , pp. 634-638(5)

Publisher: Maney Publishing

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Abstract:

In the present work, the pulse electrodeposition of tin from sulphate bath containing SnSO4, H2SO4, phenol sulphonic acid, gelatin and β-napthol has been studied. The influences of pulsed current, duty cycle on the thickness, hardness and current efficiency of the tin deposit were studied. Electrochemical corrosion studies of the deposited tin on mild steel were conducted by potentiodynamic polarisation and electrochemical impedance spectroscopy. Cyclic voltammetry studies using potential sweep of 10 mV s–1 provide information about the potential ranges for tin deposition and stripping. The tin deposit on a brass substrate has been investigated using XRD, SEM and AFM. The XRD analysis revealed that the tin plated is Sn(200) and crystalline. The morphology of tin deposit is a typical fine grained and granular structure as seen from SEM and AFM.

Keywords: TIN; HARDNESS; PULSE CURRENT; CYCLIC VOLTAMMETRY

Document Type: Research Article

DOI: http://dx.doi.org/10.1179/026708408X383957

Affiliations: 1: Central Electrochemical Research Institute, Karaikudi 630 006, India;, Email: sanjnamohan@yahoo.com 2: Central Electrochemical Research Institute, Karaikudi 630 006, India

Publication date: 2009-11-01

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