Electroless Ni–P coating on W–Cu alloy via potential activation process
Authors: Wang, L. L.; Chen, H. J.; Huang, W. Q.; Hao, L.
Source: Surface Engineering, Volume 25, Number 5, July 2009 , pp. 376-381(6)
Publisher: Maney Publishing
Abstract:Electroless Ni–P coating was deposited on W–Cu alloy via potential activation at −0·8 V. The coating was characterised for its morphology, structure, microhardness and the corrosion resistance. Scanning electron microscopy observation showed the presence of smooth and compact crystals in the coating. X-ray diffraction analysis showed that the Ni–P coating was amorphous in structure. The adhesion between Ni–P coating and W–Cu alloy was qualified. Heat treatment can improve the microhardness of Ni–P coating. Both the porosity test and immersion test in 10 vol.-% H2SO4 solution revealed that the Ni–P coating exhibited good corrosion resistance properties in protecting the W–Cu alloy.
Document Type: Research Article
Publication date: 2009-07-01
- Materials Science and Technology is Journal of the Month in November. This means free online access to all of the last 3 years of content, including the most recently published 2013 articles! Find out more here
- Editorial Board
- Information for Authors
- Subscribe to this Title
- Terms & Conditions
- Online submission site
- ingentaconnect is not responsible for the content or availability of external websites